FUJITSU SEMICONDUCTOR
SUPPORT SYSTEM
SS01-26015-1E
F2MC-8FX Family
LQFP-52P (0.65 mm pitch) HEADER BOARD
MB2146-261
OPERATION MANUAL
• The contents of this document are subject to change without notice.
Customers are advised to consult with FUJITSU sales representatives before ordering.
• The information, such as descriptions of function and application circuit examples, in this document are presented sole-
ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU
does not warrant proper operation of the device with respect to use based on such information. When you develop
equipment incorporating the device based on such information, you must assume any responsibility arising out of such
use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-
mation.
• Any information in this document, including descriptions of function and schematic diagrams, shall not be construed
as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right
of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property
right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual
property rights or other rights of third parties which would result from the use of information contained herein.
• The products described in this document are designed, developed and manufactured as contemplated for general use,
including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not
designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless
extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air
traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)
for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).
Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in
connection with above-mentioned uses of the products.
• Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from
such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-
tection, and prevention of over-current levels and other abnormal operating conditions.
• If any products described in this document represent goods or technologies subject to certain restrictions on export un-
der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be
required for export of those products from Japan.
Copyright ©2006 FUJITSU LIMITED All rights reserved
ii
1. Product Outline
■ Product outline
MB2146-261 is a header board (referred to as header board) used to connect the MCU board (model
number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F2MC-8FX family
of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment,
combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapt-
er (model number : MB2146-09).
MCU board
BGM adapter
Header board
Figure 1 System Configuration
■ Product configuration
Table 1 lists the product configuration in the header board, and Table 2 lists options.
Table 1 Product Cofiguration
Name
Description
Remarks
F2MC-8FX
Connector/LQFP52pin
(0.65 mm pitch) Package conversion
LQFP-52P (0.65 mm pitch)
header board
-
[Model number : MB2146-261]
[Model number : YQPACK052SB]
(Tokyo Eletech Corporation)
I/F between header board and NQPACK
For mounted on user system
Accessory (connected)
Accessory
[Model number : NQPACK052SB]
(Tokyo Eletech Corporation)
[Model number : HQPACK052SB]
(Tokyo Eletech Corporation)
Used when mounting mass production MCU
to NQPACK.
Accessory
Table 2 Options
Description
Name
Remarks
BGM adapter
[Model number : MB2146-09]
ICE unit for F2MC-8FX
-
MCU board
Built-inMB95FV100B-101,
Built-in F2MC-8FX evaluation MCU *
[Model number : MB2146-301, MB2146-303] MB95FV100B-103
* : Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies
the service conditions.
1
2. Checking the Delivered Product
Before using the MB2146-261, confirm that the following components are included
in the box:
• LQFP-52P (0.65 mm pitch) header board *1
: 1
: 4
: 1
: 1
: 1
• Screws for securing header board (M2 × 10 mm, 0.4 mm pitch)
• NQPACK052SB *2
• HQPACK052SB *3
• Operation manual (English version, this manual)
*1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts
YQPACK052SB.
*2 : IC socket manufactured by Tokyo Eletech Coporation, referred to as “NQPACK”, is supplied
with a special screwdriver and 2 guide pins. A socket offering higher reliability,
NQPACK052SB-SL (manufactured by Tokyo Eletech Corporation and sold separately) , can
be used by making an IC socket mounting hole on the user system board. For more information,
contact Tokyo Eletech Corporation.
*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, is
supplied with 4 screws for securing HQPACK (M2 × 6 mm, 0.4 mm pitch) .
3. Handling Precautions
The header board is precision-manufactured to improve the dimensional accuracy and to ensure a
reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct
use of the header board in the proper environment, observe the following:
• Avoid placing a stress on the NQPACK mounted on the user system board when connecting
the header board.
2
4. Notes on Designing
■ Notes on designing printed circuit board for the user system
When the header board is connected to the user system, some part mounted around the NQPACK in
the user system may be contacting the header board if the height of the part is tall. To prevent this,
design the printed circuit board for the user system so that the components do not exceed the height
shown in Figure 2. Figure 2 shows the dimension figure of the header board.
PCW-1-1-1PW
:MAC EIGHT
40.0 mm
30.0 mm
㪚㪥㪊
㪬㪈
WR-120SB-VF-N1 : JAE *2
WR-120SB-VF-N1 : JAE *2
YQPACK052SB
:Tokyo Eletech Corporation
NQPACK052SB
:Tokyo Eletech Corporation
U1:
User system I/F connector
CN3:
CN1/CN2:
Incorrect insertion prevention socket
MCU board I/F connector
*1 : The height differs slightly depending on how the YQPACK and NQPACK are engaged.
*2 : Japan Aviation Electronics Industry, Limited
Figure 2 Header Board Dimensions
3
■ MCU footprint design notes
Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed cir-
cuit board for the user system. Take the footprint in Figure 3 into consideration as well as the foot-
print of the mass production MCU when designing the printed circuit board for the user system.
To follow the most updated information, be sure to contact Tokyo Eletech Corporation whenever de-
signing the printed circuit board.
0.4 mm
0.65 mm
No.1 Pin
Figure 3 Recommended Footprint Dimensions for Mounting the NQPACK
4
5. Connecting to the User System
■ Connecting
Mount the supplied NQPACK on the user system before using the MB2146-261.
1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on
the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut
linearly at one place only in silk screen) on the header board and then insert it (see “Figure 4”) .
The pins of YQPACK are thin and easy to bend. Insert NQPACK after confirming that the pins
of YQPACK are not bent.
NQPACK index mark
Header board index mark
Figure 4 Index Position
2. Insert each screw for securing the header board into each of the four tapped holes on the header
board, and then tighten the screws diagonally. The center screw hole is not used. To tighten the
screws, use the special screwdriver supplied with the NQPACK to equally tighten the four screws
in sequence. Tightening the screws too tight might result in a defective contact.
3. Connect the MCU board to the header board while being careful not to excessively force the NQ-
PACK. The MCU board can be connected to the header board only in the correct orientation as
they have an incorrect insertion prevention header socket to prevent a reverse connection. Figure
5 illustrates how the MCU board, header board, NQPACK, and user system are connected togeth-
er.
5
MCU board
Evaluation
MCU
MCU board
Screws for securing
header board
Header board
Connected
at shipment
YQPACK
NQPACK
User system
Figure 5 Connecting MCU Board/Header Board to User System
■ Disconnection
1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not
excessively forcing the junction with the NQPACK.
2. Remove all of the four screws from the header board. Pull out the header board vertically from
the NQPACK. Remove the header board slowly not excessively forcing the junction with the
NQPACK.
6
6. Mounting Mass Production MCUs
■ Mounting
To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover)
(see “Figure 6”) .
1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQ-
PACK mounted on the user system with the index mark (●) on the mass production MCU.
2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the
index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one
place only) .
The pins of HQPACK are thin and easy to bend. Insert NQPACK after confirming that pins of
HQPACK are not bent.
3. Insert each screw for securing HQPACK in each of four tapped holes on the HQPACK, and then
tighten the screws diagonally. To tighten the screws, use the special screwdriver supplied with
the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight
might result in a defective contact.
Screws for securing HQPACK
HQPACK
Mass production MCU
NQPACK
User system
Figure 6 Mounting a Mass Production MCU
■ Disconnection
To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from
the NQPACK. When taking out the mass production MCU, absorb the mass production MCU using
a vacuum pick-up tool special for removing IC. Do not attempt to remove the mass production MCU
forcibly, for example, using a screwdriver to do so can bend the pins of the mass production MCU
or break the NQPACK.
7
7. Product Specifications
■ General specifications
Table 3 lists the general specifications of the header board.
Table 3 General Specifications
Item
Description
Operating temperature and storage temperature
Operating humidity and storage humidity
5 °C to 35 °C (operation) , 0 °C to 40 °C (storage)
20 % to 80 % (operation) , 20 % to 80 % (storage)
Approximately 40 mm × 40 mm × 16 mm
(Height contains that of YQPACK and NQPACK)
Dimensions
■ Main part
The main part of a header board is shown in Table 4.
Table 4 Main Part
Name
Description
120 pin, 0.5 mm pitch, 2-piece connector
(straight) × 2
[Model number : WR-120SB-VF-N1
(from Japan Aviation Electronics Industry, Limited) ]
MCU board I/F connector
2 pin, 2.54 mm pitch, 1-piece socket
(Straight)
[Model number : PCW-1-1-1PW (from MAC EIGHT) ]
Incorrect insertion prevention socket
User target system I/F connector
■ Functional block diagram
Socket
52 pin, 0.65 mm pitch
[Model number : YQPACK052SB (from Tokyo Eletech Corporation) ]
A header board performs socket conversion between the MCU board I/F connector and YQPACK.
The header board does not contain any component such as an IC internally. Figure 7 shows the block
diagram.
MCU board I/F connector
User target system I/F connector
(Socket for package)
Figure 7 Functional Block Diagram
8
■ MCU board I/F connector (CN1, CN2, and CN3)
CN1 and CN2 are MCU board I/F connectors. CN3 is the incorrect insertion prevention socket of a
MCU board. The pin assignment of the MCU board I/F connector CN1 is shown in Table 5, and the
pin assignment of the MCU board I/F connector CN2 is shown in Table 6.
Table 5 Pin Assignment of the MCU Board I/F Connector CN1
Connector
Pin
Number
Connector
Pin
Number
Connector
Pin
Number
Evaluation
MCU Pin
Number
Evaluation
MCU Pin
Number
Evaluation
MCU Pin
Number
Signal
name
Signal
name
Signal
name
1
A9
B9
C9
D9
A8
B8
C8
D8
A7
B7
C7
D7
A6
B6
C6
D6
A5
B5
C5
D5
A4
A3
-
PC4
PC1
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
E2
E1
F4
F3
F2
F1
-
LVR3
LVSS
LVDREXT
LVDBGR
LVDENX
P22A
GND
GND
P20A
NC1
81
82
P3
P4
R1
R2
R3
R4
T1
T2
T3
T4
U1
U2
U3
U4
V1
V2
-
BSOUT
BDBMX
P83
2
3
PC2
83
4
PC3
84
BRSTX
X0A
5
PC0
85
6
PB4
86
RSTX
7
PB5
87
ROMS1
BSIN
8
PB6
-
88
9
PB7
G4
G3
G2
G1
H4
H3
H2
H1
J4
89
Vss
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
PB2
90
X0
PB0
P21A
P23A
P24A
P25A
P26A
P27A
P24B
P50
91
BEXCK
X1
PB1
92
PB3
93
MOD
PA2
94
PF2
P95
95
X1A
PA0
96
Vcc53
PA3
97
GND
P94
J3
98
-
GND
P90
J2
P23B
P51
99
V3
V4
R5
T5
U5
V5
R6
T6
U6
V6
R7
T7
U7
V7
R8
T8
U8
V8
R9
T9
U9
V9
PINT0
PSEL_EXT
PF1
P91
J1
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
PA1
K1
K2
K3
K4
L1
L2
L3
L4
M1
M2
M3
M4
-
P52
P93
P55
PF0
GND
GND
CSVENX
Vss
P54
NC2
-
P53
PENABLE
APBENX
PINT1
PCLK
A2
A1
B4
B3
B2
B1
C4
C3
C2
C1
D4
D3
D2
D1
E4
E3
P70
P74
P92
P73
TCLK
LVCC
LVDIN
Cpin
P72
PADDR0
PACTIVE
PLOCK
PWRITE
PADDR1
PADDR2
PADDR3
PADDR4
PADDR5
PADDR7
PRDATA0
PADDR6
PRDATA1
P71
P76
P80
Vcc51
LVDENX2
LVR4
TESTO
LVDOUT
LVR2
BGOENX
LVR1
LVR0
P77
GND
GND
P75
-
N1
N2
N3
N4
P1
P2
P82
PG0
P84
P81
ROMS0
9
Table 6 Pin Assignment of the MCU Board I/F Connector CN2
Connector
Pin
Number
Connector
Pin
Number
Connector
Pin
Number
Evaluation
MCU Pin
Number
Evaluation
MCU Pin
Number
Evaluation
MCU Pin
Number
Signal
name
Signal
name
Signal
name
1
A10
B10
C10
D10
A11
B11
C11
D11
A12
B12
C12
D12
A13
B13
C13
D13
A14
B14
C14
D14
A15
A16
-
PC5
PD0
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
E17
E18
F15
F16
F17
F18
-
NC4
SEL0
SEL3
SEL4
SEL1
P04C
GND
GND
P06C
P07C
P05C
P00C
P01C
P02C
P03C
P07A
P04A
P05A
P06A
P03A
P02A
P07B
P01A
P00A
P06B
P05B
P04B
P03B
P02B
P00B
P46
81
82
P16
P15
R18
R17
R16
R15
T18
T17
T16
T15
U18
U17
U16
U15
V18
V17
-
P34
P35
2
3
PC6
83
P44
4
PC7
84
P36
5
PD1
85
P31
6
PD2
86
AVcc3
P40
7
PD3
87
8
PD4
-
88
P32
9
PD5
G15
G16
G17
G18
H15
H16
H17
H18
J15
89
AVss
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
PD7
90
AVR
P61
91
P33
P60
92
P30
PD6
93
AVR3
P64
94
P15
P66
95
AVcc
P65
96
DA0
P62
97
GND
PE0A
PE3A
PE2A
P63
J16
J17
J18
K18
K17
K16
K15
L18
L17
L16
L15
M18
M17
M16
M15
-
98
-
GND
99
V16
V15
R14
T14
U14
V14
R13
T13
U13
V13
R12
T12
U12
V12
R11
T11
U11
V11
R10
T10
U10
V10
P14
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
P10
P16
P67
DA1
GND
GND
PE4A
Vcc54
PE1A
PE5A
PE7A
PE3B
PE6A
Vss
P13
-
PWDATA7
P11
A17
A18
B15
B16
B17
B18
C15
C16
C17
C18
D15
D16
D17
D18
E15
E16
P12
NC3
PWDATA3
PWDATA5
PWDATA6
PWDATA4
PRDATA7
PWDATA0
PWDATA1
PWDATA2
PRDATA6
PRDATA3
PRDATA4
PRDATA5
PRDATA2
P47
PE2B
PE7B
PE1B
PE0B
PE6B
SEL2
PE5B
PE4B
GND
GND
P01B
P43
-
N18
N17
N16
N15
P18
P17
P41
P42
P45
P37
10
■ User system I/F YQPACK (U1)
The pin assignment of user system I/F YQPACK in the header board is shown in Table 7.
Table 7 Pin Assignment of the User System I/F YQPACK in Header Board
Connector
Connector
Pin Number
Signal name
Signal name
Pin Number
1
P61/S09/PPG11
P62/S10/TO10
P63/S11/TO11
P64/S12/EC1
P65/S13/SCK
P66/S14/SOT
NC
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
VCC
Cpin
2
3
X1A
4
X0A
5
RSTX
6
P90/V3
7
NC
8
P67/S15/SIN
P14/PPG0
P91/V2
9
P92/V1
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
P13/TRG0/ADTG
P12/UCK0
P93/V0
P94/C0
P11/UO0
P95/C1
P10/UI0
PA0/COM0
PA1/COM1
PA2/COM2
PA3/COM3
PB0/S00
PB1/S01
PB2/S02
NC
P07/INT07/AN07
P06/INT06/AN06
P05/INT05/AN05
P04/INT04/AN04
P03/INT03/AN03
P02/INT02/AN02
NC
P01/INT01/AN01
P00/INT00/AN00
MO
PB3/S03/PPG00
PB4/S04/PPG01
PB5/S05/TO00
PB6/S06/TO01
PB7/S07/EC0
P60/S08/PPG10
X0
X1
VSS
11
SS01-26015-1E
FUJITSU SEMICONDUCTOR • SUPPORT SYSTEM
F2MC-8FX Family
LQFP-52P (0.65 mm pitch) HEADER BOARD
MB2146-261
OPERATION MANUAL
April 2006 the first edition
Published FUJITSU LIMITED Electronic Devices
Edited Business Promotion Dept.
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