INTEGRATED CIRCUITS
DATA SHEET
TDA7052A/AT
1 W BTL mono audio amplifier with
DC volume control
July 1994
Product specification
File under Integrated circuits, IC01
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
V
P
1
7
n.c.
TDA7052A
TDA7052AT
I + i
5
positive output
2
4
positive input
DC volume
control
I
– i
8
negative output
STABILIZER TEMPERATURE
PROTECTION
V
ref
3
6
MCD385 - 1
signal
ground
power
ground
Fig.1 Block diagram.
PINNING
SYMBOL
PIN
DESCRIPTION
handbook, halfpage
V
VP
1
2
3
4
5
6
7
8
positive supply voltage
positive input
1
2
8
OUT –
n.c.
P
IN+
IN +
7
6
5
TDA7052A
TDA7052AT
GND1
VC
signal ground
GND1
VC
3
4
GND2
OUT +
DC volume control
positive output
power ground
OUT+
GND2
n.c
MCD384
not connected
Fig.2 Pin configuration.
OUT−
negative output
July 1994
3
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
Thus a reduced power supply with smaller capacitors can
be used which results in cost savings.
FUNCTIONAL DESCRIPTION
The TDA7052A/AT are mono BTL output amplifiers with
DC volume control, designed for use in TV and monitors
but also suitable for battery fed portable recorders and
radios.
For portable applications there is a trend to decrease the
supply voltage, resulting in a reduction of output power at
conventional output stages. Using the BTL principle
increases the output power.
In conventional DC volume circuits the control or input
stage is AC coupled to the output stage via external
capacitors to keep the offset voltage low.
The maximum gain of the amplifier is fixed at 35.5 dB. The
DC volume control stage has a logarithmic control
characteristic.
In the TDA7052A/AT the DC volume control stage is
integrated into the input stage so that no coupling
capacitors are required and yet a low offset voltage is
maintained. At the same time the minimum supply remains
low.
The total gain can be controlled from 35.5 dB to −44 dB. If
the DC volume control voltage is below 0.3 V, the device
switches to the mute mode.
The amplifier is short-circuit proof to ground, VP and
across the load. Also a thermal protection circuit is
implemented. If the crystal temperature rises above
+150 °C the gain will be reduced, so the output power is
reduced.
The BTL principle offers the following advantages:
• Lower peak value of the supply current
• The frequency of the ripple on the supply voltage is twice
the signal frequency.
Special attention is given to switch on and off clicks, low
HF radiation and a good overall stability.
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134)
SYMBOL
VP
PARAMETER
supply voltage range
CONDITIONS
MIN.
MAX.
18
UNIT
−
−
−
V
A
A
IORM
IOSM
Ptot
repetitive peak output current
non-repetitive peak output current
total power dissipation
TDA7052A
1.25
1.5
Tamb ≤ 25%
−
−
1.25
0.8
+85
+150
+150
1
W
W
°C
°C
°C
hr
V
TDA7052AT
Tamb
Tstg
Tvj
operating ambient temperature range
storage temperature range
virtual junction temperature
short-circuit time
−40
−55
−
Tsc
V2
−
−
input voltage pin 2
8
V4
input voltage pin 4
−
8
V
July 1994
4
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
THERMAL RESISTANCE
SYMBOL
PARAMETER
THERMAL RESISTANCE
Rth j-a
from junction to ambient in free air
TDA7052A
100 K/W
155 K/W
TDA7052AT
Notes to the thermal resistance
TDA7052A: VP = 6 V; RL = 8 Ω. The maximum sine-wave dissipation is 0.9 W.
Therefore Tamb(max) = 150 − 100 × 0.9 = 60 °C.
TDA7052AT: VP = 6 V; RL = 16 Ω. The maximum sine-wave dissipation is 0.46 W.
Therefore Tamb(max) = 150 − 155 × 0.46 = 78 °C.
July 1994
5
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
CHARACTERISTICS
VP = 6 V; Tamb = 25 °C; f = 1 kHz; TDA7052A: RL = 8 Ω; TDA7052AT: RL = 16 Ω; unless otherwise specified (see Fig.6).
SYMBOL
VP
IP
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
positive supply voltage range
total quiescent current
4.5
−
7
18
12
V
VP = 6 V; RL = ∞
−
mA
note 1
Maximum gain; V4 = 1.4 V
PO
output power
THD = 10%
TDA7052A
1.0
0.5
1.1
−
−
W
W
TDA7052AT
0.55
THD
total harmonic distortion
TDA7052A
PO = 0.5 W
−
−
0.3
0.3
1
1
%
%
TDA7052AT
PO = 0.25 W
Gv
voltage gain
34.5 35.5
36.5 dB
VI
input signal handling
noise output voltage (RMS value)
bandwidth
V4 = 0.8 V; THD < 1%
f = 500 kHz; note 2
−1 dB
0.5
−
−
0.65
210
−
−
−
V
Vno(rms)
B
µV
20 Hz to
300 kHz
SVRR
|Voff|
ZI
supply voltage ripple rejection
DC output offset voltage
input impedance (pin 2)
note 3
38
−
46
0
−
150
25
dB
mV
kΩ
15
20
Minimum gain; V4 = 0.5 V
Gv
voltage gain
−
−
−44
20
−
30
dB
Vno(rms)
noise output voltage (RMS value)
note 4
µV
Mute position
VO
output voltage in mute position
V4 ≤ 0.3 V; VI = 600 mV
−
−
30
µV
DC volume control
φ
I4
gain control range
control current
75
60
80
70
−
80
dB
V4 = 0.4 V
µA
Notes to the characteristics
1. With a load connected to the outputs the quiescent current will increase, the maximum value of this increase being
equal to the DC output offset voltage dividend by RL.
2. The noise output voltage (RMS value) at f = 500 kHz is measured with RS = 0 Ω and bandwidth = 5 kHz.
3. The ripple rejection is measured with RS = 0 Ω and f = 100 Hz to 10 kHz. The ripple voltage of 200 mV, (RMS value)
is applied to the positive supply rail.
4. The noise output voltage (RMS value) is measured with RS = 5 kΩ unweighted.
July 1994
6
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
MCD389 - 1
MCD388
1000
40
gain
(dB)
handbook, halfpage
handbook, halfpage
V
noise
(µV)
20
0
800
600
400
200
– 20
– 40
– 60
– 80
0
0
0.4
0.8
1.2
1.6
2.0
0
0.4
0.8
1.2
1.6
2.0
(V)
V
V
(V)
4
4
Fig.4 Noise output voltage as a function of DC
volume control.
Fig.3 Gain control as a function of DC volume control.
MCD390 - 1
100
handbook, halfpage
I
4
(µA)
60
20
– 20
– 60
– 100
0
0.4
0.8
1.2
1.6
2.0
(V)
V
4
Fig.5 Control current as a function of DC volume
control.
July 1994
7
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
APPLICATION INFORMATION
(1)
V
= 6 V
P
100 nF
220 µF
1
7
n.c.
TDA7052A
TDA7052AT
I + i
5
positive
input
0.47 µF
2
R
R
= 8 Ω
L
4
(TDA7052A)
= 16 Ω
L
(TDA7052A/AT)
I – i
8
R
5 kΩ
S
STABILIZER
TEMPERATURE
PROTECTION
V
ref
DC
volume
control
3
6
MCD386 - 1
This capacitor can be omitted if the 220 µF electrolytic capacitor is connected close to pin 1.
ground
Fig.6 Test and application diagram.
handbook, halfpage
volume
control
4
1 µF
1 MΩ
MCD387
Fig.7 Application with potentiometer as volume
control; maximum gain = 30 dB.
July 1994
8
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
(1)
(1)
1
2
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT97-1
050G01
MO-001AN
July 1994
9
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-05-22
SOT96-1
076E03S
MS-012AA
July 1994
10
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
July 1994
11
Philips Semiconductors
Product specification
1 W BTL mono audio amplifier with DC
volume control
TDA7052A/AT
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
12
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