Philips Stereo Amplifier TDA1552Q User Manual

INTEGRATED CIRCUITS  
DATA SHEET  
TDA1552Q  
2 x 22 W BTL stereo car radio  
power amplifier  
July 1994  
Product specification  
File under Integrated Circuits, IC01  
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
V
V
P1  
P2  
3
10  
1
mute switch  
C
m
input 1  
4
VA  
output 1A  
2
kΩ  
18 kΩ  
power stage  
mute switch  
C
m
6
VA  
output 1B  
60  
kΩ  
2
kΩ  
18 kΩ  
power stage  
V
P
11  
12  
mute/stand-by  
not connected  
stand-by  
switch  
stand-by  
reference  
voltage  
VA  
15 kΩ  
x1  
mute  
switch  
TDA1552Q  
15 kΩ  
V
ref  
13  
mute switch  
C
m
input 2  
9
VA  
output 2B  
2
kΩ  
18 kΩ  
power stage  
mute switch  
C
m
7
VA  
output 2A  
60  
kΩ  
2
kΩ  
V
ref  
18 kΩ  
power stage  
2
5
GND1  
8
MLB952  
GND2  
ground (signal)  
power ground (substrate)  
Fig.1 Block diagram.  
3
July 1994  
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
PINNING  
1
2
3
4
5
6
7
IP1  
input 1  
8
9
GND2  
power ground 2 (substrate)  
GND  
ground (signal)  
positive supply voltage 1  
output 1A  
OUT2B  
output 2B  
V
10  
11  
12  
13  
V
positive supply voltage 2  
mute/stand-by switch  
not connected  
input 2  
P1  
P2  
OUT1A  
GND1  
M/SS  
n.c.  
power ground 1 (substrate)  
output 1B  
OUT1B  
OUT2A  
IP2  
output 2A  
FUNCTIONAL DESCRIPTION  
The TDA1552Q contains two identical amplifiers with differential input stages and can be used for bridge applications.  
The gain of each amplifier is fixed at 26 dB. A special feature of this device is:  
Mute/stand-by switch  
low stand-by current (< 100 µA)  
low mute/stand-by switching current (low cost supply switch)  
mute facility.  
RATINGS  
Limiting values in accordance with the Absolute Maximum System (IEC 134)  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
MAX.  
UNIT  
Supply voltage  
operating  
V
18  
30  
V
V
P
non-operating  
V
P
load dump protected  
during 50 ms;  
t 2.5 ms  
V
I
45  
6
V
r
P
Non-repetitive peak output current  
Repetitive peak output current  
Storage temperature range  
Junction temperature  
A
OSM  
ORM  
I
4
A
T
T
55  
+150  
150  
18  
°C  
°C  
V
stg  
j
AC and DC short-circuit-safe voltage  
Energy handling capability at outputs  
Reverse polarity  
V
PSC  
V = 0 V  
200  
6
mJ  
V
P
V
P
PR  
Total power dissipation  
see Fig.2  
60  
W
tot  
July 1994  
4
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
Fig.2 Power derating curve.  
July 1994  
5
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
DC CHARACTERISTICS  
V = 14.4 V; T  
= 25 °C; measurements taken using Fig.3; unless otherwise specified  
P
amb  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
TYP.  
MAX.  
UNIT  
Supply  
Supply voltage range  
Total quiescent current  
DC output voltage  
note 1  
V
6.0  
14.4  
18.0  
V
P
I
80  
6.9  
160  
mA  
V
tot  
note 2  
V
O
DC output offset voltage  
|V |  
150  
mV  
O
Mute/stand-by switch  
Switch-on voltage level  
Mute condition  
V
8.5  
3.3  
6.4  
V
V
ON  
V
mute  
Output signal in mute  
position  
V = 1 V (max);  
I
f = 1 kHz  
V
2
mV  
O
DC output offset voltage  
(between pins 4 to 6 and 7 to 9)  
|V |  
0
150  
2
mV  
V
O
V
Stand-by condition  
sb  
DC current in  
V < 0.5 V  
I
100  
500  
60  
µA  
µA  
µA  
II  
sb  
stand-by condition  
Switch-on current  
Supply current  
0.5 V V < 2 V  
I
I
II  
sb  
25  
sw  
short-circuit  
to GND  
note 3  
I
5.5  
mA  
P
July 1994  
6
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
AC CHARACTERISTICS  
V = 14.4 V; R = 4 ; f = 1 kHz; T  
= 25 °C; measurements taken using Fig.3; unless otherwise specified  
P
L
amb  
PARAMETER  
CONDITIONS  
SYMBOL  
MIN.  
15  
TYP.  
17  
MAX.  
UNIT  
Output power  
THD = 0.5%  
THD = 10%  
THD = 0.5%  
THD = 10%  
P
-
W
o
o
o
o
P
P
P
20  
22  
12  
17  
0.1  
W
W
W
%
Output power at V = 13.2 V  
P
Total harmonic distortion  
Power bandwidth  
P = 1 W  
THD  
o
THD = 0.5%  
P = 1 dB  
o
w.r.t. 15 W  
B
-
20 to  
Hz  
w
15000  
Low frequency roll-off  
note 4  
1 dB  
1 dB  
f
25  
26  
27  
Hz  
kHz  
dB  
dB  
dB  
dB  
dB  
kΩ  
L
High frequency roll-off  
Closed loop voltage gain  
Supply voltage ripple rejection  
ON  
f
20  
25  
42  
48  
48  
80  
50  
H
G
v
notes 5, 6  
RR  
RR  
RR  
RR  
notes 5, 7  
mute  
notes 5, 6, 7  
notes 5, 6, 7  
stand-by  
60  
75  
Input impedance  
Noise output voltage  
(RMS value)  
|Z |  
i
ON  
R = 0 ; note 8  
V
-
70  
100  
60  
120  
1
µV  
µV  
µA  
dB  
dB  
S
no(rms)  
no(rms)  
no(rms)  
ON  
R = 10 k; note 8 V  
40  
-
S
mute  
notes 8, 9  
V
Channel separation  
Channel unbalance  
α
|G |  
v
Notes to the characteristics  
1. The circuit is DC adjusted at V = 6 V to 18 V and AC operating at V = 8.5 V to 18 V.  
P
P
2. At 18 V < V < 30 V the DC output voltage V /2.  
P
P
3. Conditions:  
a) V = 0 V  
11  
b) short-circuit to GND  
c) switch V to MUTE or ON condition (rise time 10 µs).  
11  
4. Frequency response externally fixed.  
5. Ripple rejection measured at the output with a source impedance of 0 (maximum ripple amplitude of 2 V).  
6. Frequency f = 100 Hz.  
7. Frequency between 1 kHz and 10 kHz.  
8. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.  
9. Noise output voltage independent of R (V = 0 V).  
S
I
July 1994  
7
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
APPLICATION INFORMATION  
mute/stand-by switch  
V
P
not connected  
12  
14.4 V  
2200  
µF  
100  
nF  
11  
3
10  
220 nF  
1
input 1  
4
6
R
= 4 Ω  
L
60  
kΩ  
2
ground (signal)  
TDA1552Q  
reference  
voltage  
220 nF  
13  
input 2  
9
60  
kΩ  
R
= 4 Ω  
L
7
5
8
MLB951  
power ground (substrate)  
Fig.3 Application circuit diagram.  
8
July 1994  
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
PACKAGE OUTLINE  
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)  
SOT141-6  
non-concave  
x
D
h
D
E
h
view B: mounting base side  
d
A
2
B
j
E
A
L
3
L
Q
c
1
13  
e
e
m
v
M
w
M
1
Z
2
b
p
e
0
5
10 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
(1)  
(1)  
UNIT  
A
A
b
c
D
d
D
E
e
e
e
E
j
L
L
3
m
Q
v
w
x
Z
2
p
h
1
2
h
17.0 4.6 0.75 0.48 24.0 20.0  
15.5 4.2 0.60 0.38 23.6 19.6  
12.2  
11.8  
3.4 12.4 2.4  
3.1 11.0 1.6  
2.00  
1.45  
2.1  
1.8  
6
mm  
10  
3.4  
1.7 5.08  
0.8  
4.3  
0.25 0.03  
Note  
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
92-11-17  
95-03-11  
SOT141-6  
July 1994  
9
 
Philips Semiconductors  
Product specification  
2 x 22 W BTL stereo car radio power  
amplifier  
TDA1552Q  
The device may be mounted up to the seating plane, but  
the temperature of the plastic body must not exceed the  
SOLDERING  
Introduction  
specified maximum storage temperature (T  
). If the  
stg max  
printed-circuit board has been pre-heated, forced cooling  
may be necessary immediately after soldering to keep the  
temperature within the permissible limit.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
Repairing soldered joints  
Apply a low voltage soldering iron (less than 24 V) to the  
lead(s) of the package, below the seating plane or not  
more than 2 mm above it. If the temperature of the  
soldering iron bit is less than 300 °C it may remain in  
contact for up to 10 seconds. If the bit temperature is  
between 300 and 400 °C, contact may be up to 5 seconds.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
Soldering by dipping or by wave  
The maximum permissible temperature of the solder is  
260 °C; solder at this temperature must not be in contact  
with the joint for more than 5 seconds. The total contact  
time of successive solder waves must not exceed  
5 seconds.  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
July 1994  
10  
 

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